Topology-Optimized Kirigami Design of Electrospun BNNS/PVA Composite Films for Flexible Electronics Thermal Management
Yanyan Xu, Bin Xie, Mingxiang Chen, Xin Tang · 2026
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Description
Yanyan Xu and colleagues give flexible electronics a cooler skin in 2026 by cutting a boron nitride composite film into a topology-optimized kirigami pattern. Flexible circuits still generate heat, and stiff heat spreaders defeat the point of bending. Their film electrospins boron nitride nanosheets into a polyvinyl alcohol web, then a computer optimization carves the paper-cut pattern that best balances heat flow against stretch.
The composite web raised in-plane thermal conductivity from 0.19 to 4.63 watts per meter-kelvin. Under identical heating, the optimized kirigami cut the average temperature from 86 to 53 degrees Celsius and quartered the stored elastic strain energy, from 43 joules to 11. Conductivity survived 300 bending cycles. Marrying a heat-hungry filler network with a cut pattern that yields gracefully is a design strategy wearable and foldable devices can reuse.
Catalog record
| CREATOR | Yanyan Xu, Bin Xie, Mingxiang Chen, Xin Tang |
|---|---|
| YEAR | 2026 |
| COLLECTION | PAPERS |
| FORMAT | TXT |
| FILE SIZE | 41 KB |
| LICENSE | https://creativecommons.org/licenses/by/4.0 |
| RIGHTS | CC BY |
| SOURCE | Europe PMC |