Hierarchically Biporous Wick Vapor Chamber With Micro/Nano Condenser for Exceeding 600 W/cm2 Heat Dissipation
Ya‐Nan Li, Run‐Sheng Qi, Yawen Shi, Zeng‐Yao Li, Xinpeng Zhao · 2026
Read Hierarchically Biporous Wick Vapor Chamber With Micro/Nano Condenser for Exceeding 600 W/cm2 Heat Dissipation by Ya‐Nan Li, Run‐Sheng Qi, Yawen Shi, Zeng‐Yao Li, Xinpeng Zhao (2026) in the Tower of Babel, a free online library of public-domain works preserved in clean, searchable text. No sign-up. The full text is served as a plain-text file at a predictable URL, where text is present: https://antarctic-labs.com/tower-of-babel/PMC13450345.txt.
Description
Ya-Nan Li and colleagues report in 2026 a flat vapor chamber cooler that sheds heat at rates modern power chips demand and conventional chambers cannot reach. Vapor chambers move heat by evaporating and condensing a working fluid, but under extreme load the returning liquid cannot keep up through a single wick. Their redesign pairs a two-scale porous wick, super-wettable, that pulls condensate back hard, with a condenser patterned at micro and nano scales so droplets bead and shed instead of filming over.
The chamber reached a total thermal resistance near 0.17 degrees per watt, with temperature uniformity resistance around 0.02. Its dissipation flux passed 600 watts per square centimeter, and it kept working tilted against gravity, the orientation that starves ordinary wicks. The authors offer the design as a serious candidate for the next generation of gallium nitride and silicon carbide power electronics, where heat flux is the binding constraint.
Catalog record
| CREATOR | Ya‐Nan Li, Run‐Sheng Qi, Yawen Shi, Zeng‐Yao Li, Xinpeng Zhao |
|---|---|
| YEAR | 2026 |
| COLLECTION | PAPERS |
| FORMAT | TXT |
| FILE SIZE | 38300 |
| LICENSE | https://creativecommons.org/licenses/by/4.0 |
| RIGHTS | CC BY |
| SOURCE | Europe PMC |