Embedded glass fan-out integration method for high-performance Ka-band RF microsystem
Bohan Zhang, Lang Chen, Qi Wang, Wei Wang · 2026
Read Embedded glass fan-out integration method for high-performance Ka-band RF microsystem by Bohan Zhang, Lang Chen, Qi Wang, Wei Wang (2026) in the Tower of Babel, a free online library of public-domain works preserved in clean, searchable text. No sign-up. The full text is served as a plain-text file at a predictable URL, where text is present: https://antarctic-labs.com/tower-of-babel/PMC13392140.txt.
Description
Bohan Zhang, Lang Chen, Qi Wang, and Wei Wang present, in 2026, a glass-based packaging method for high-frequency radio microsystems. Next-generation networks demand low signal loss at millimetre-wave frequencies, which monolithic chips struggle to deliver.
Glass interposers offer low dielectric loss, flatness, and adjustable thermal expansion, suiting them to Ka-band systems. The team used laser-induced deep etching to carve precise cavities with clean vertical walls in glass, then embedded dies by a fan-out process for dense, low-noise integration. Radio frequency engineers gain a manufacturing route that tackles glass machining, historically the weak point of glass packaging, for high-performance communication hardware.
Catalog record
| CREATOR | Bohan Zhang, Lang Chen, Qi Wang, Wei Wang |
|---|---|
| YEAR | 2026 |
| COLLECTION | PAPERS |
| FORMAT | TXT |
| FILE SIZE | 34905 |
| LICENSE | https://creativecommons.org/licenses/by/4.0 |
| RIGHTS | CC BY |
| SOURCE | Europe PMC |