Ultra-Precise Dispensing for Rapid and Flexible Through-Silicon Via Filling
Nina Szczotka, Shadi Nashashibi, Aleksandra Motyka, Sławomir Drozdek, Juerg Leuthold, Karol Malecha · 2026
Read Ultra-Precise Dispensing for Rapid and Flexible Through-Silicon Via Filling by Nina Szczotka, Shadi Nashashibi, Aleksandra Motyka, Sławomir Drozdek, Juerg Leuthold, Karol Malecha (2026) in the Tower of Babel, a free online library of public-domain works preserved in clean, searchable text. No sign-up. The full text is served as a plain-text file at a predictable URL, where text is present: https://antarctic-labs.com/tower-of-babel/pmc-13165430.txt.
Description
Szczotka and co-authors fill the tiny vertical tunnels of stacked chips with a precision dispenser instead of the usual elaborate metal coating steps. Through silicon vias link chip layers in 3D circuits, and their standard filling slows prototyping. Their 2026 study dispenses a silver nanoparticle paste into the holes and checks shape, fill quality, and electrical behavior.
The team filled vias through a 280 micrometer wafer with holes as narrow as twenty micrometers, a depth to width ratio up to fourteen to one. The filled vias conducted well. The authors say the additive route promises simpler, cheaper fabrication with more design freedom, a step toward dense high ratio vias made without the standard process chain.
Catalog record
| CREATOR | Nina Szczotka, Shadi Nashashibi, Aleksandra Motyka, Sławomir Drozdek, Juerg Leuthold, Karol Malecha |
|---|---|
| YEAR | 2026 |
| COLLECTION | PAPERS |
| FORMAT | TXT |
| FILE SIZE | 29 KB |
| VERSION | 1.0 |
| LICENSE | CC BY 4.0 |
| RIGHTS | CC BY |
| SOURCE | Europe PMC |