Electrodeposition, microstructure and characterization of high-strength, low-roughness copper foils with polyethylene glycol additives†
Jian Huang, Ning Song, Mingwei Chen, Yunzhi Tang, Xiaowei Fan · 2024
Read Electrodeposition, microstructure and characterization of high-strength, low-roughness copper foils with polyethylene glycol additives† by Jian Huang, Ning Song, Mingwei Chen, Yunzhi Tang, Xiaowei Fan (2024) in the Tower of Babel, a free online library of public-domain works preserved in clean, searchable text. No sign-up. The full text is served as a plain-text file at a predictable URL, where text is present: https://antarctic-labs.com/tower-of-babel/pmc-11612898.txt.
Description
Electroplating additives play a key role in enhancing the physical and chemical performances of electrodeposited copper foils. Currently, a lot of research on polyethylene glycol (PEG) additives has been reported on the metallisation interconnections for printed circuit boards (PCBs); however, research on its applications for electrodeposited copper foils is rarely documented. Herein, high-quality copper foils with high tensile strength (433.
Catalog record
| CREATOR | Jian Huang, Ning Song, Mingwei Chen, Yunzhi Tang, Xiaowei Fan |
|---|---|
| YEAR | 2024 |
| COLLECTION | PAPERS |
| FORMAT | TXT |
| FILE SIZE | 28 KB |
| VERSION | 1.0 |
| LICENSE | CC BY 4.0 |
| RIGHTS | CC BY |
| SOURCE | Europe PMC |