Deformation Mechanism of Aluminum, Copper, and Gold in Nanoimprint Lithography Using Molecular Dynamics Simulation

Abhaysinh Gaikwad, Michael Olowe, Salil Desai · 2023

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Description

Abhaysinh Gaikwad, Michael Olowe, and Salil Desai published a simulation study in twenty twenty-three on how aluminum, copper, and gold deform during nanoimprint lithography. The process stamps nanoscale patterns into metal, and each metal responds differently. Molecular dynamics let the team watch atoms shift through pressing, holding, and mold removal.

Copper carried the highest internal stress and gold the lowest. All three metals formed temporary crystal structures under the mold, then recovered over half their original structure afterward. Gold sprang back least, aluminum most, and aluminum also gave the poorest imprint shape. The comparison helps engineers pick metals and settings for crisp nanoscale patterns.

Catalog record

CREATORAbhaysinh Gaikwad, Michael Olowe, Salil Desai
YEAR2023
COLLECTIONPAPERS
FORMATTXT
FILE SIZE31 KB
VERSION1.0
LICENSECC BY 4.0
RIGHTSCC BY
SOURCEEurope PMC

Source: https://europepmc.org/articles/PMC10746065

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