Effective Macroscopic Thermomechanical Characterization of Multilayer Circuit Laminates for Advanced Electronic Packaging
Hsien-Chie Cheng, Wen-You Jhu, Giovanni Garcea · 2023
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Description
Hsien-Chie Cheng and co-authors build a modeling frame for the heat and stress behavior of layered circuit boards in advanced chip packages, in work from twenty twenty-three. Laminate boards carry heat out of packages and set their warp and stress profile. Their metal traces are tiny, dense, and unevenly aimed, which makes full models costly.
The frame splits the board into sub regions, maps the traces, and averages behavior with finite element math. Boards are treated as direction dependent elastic materials. Checks against tensile and heat tests and older mixture models went well. A warpage forecast for a flip chip package matched measured data. The frame offers speed with sound accuracy for package design.
Catalog record
| CREATOR | Hsien-Chie Cheng, Wen-You Jhu, Giovanni Garcea |
|---|---|
| YEAR | 2023 |
| COLLECTION | PAPERS |
| FORMAT | TXT |
| FILE SIZE | 41 KB |
| VERSION | 1.0 |
| LICENSE | CC BY 4.0 |
| RIGHTS | CC BY |
| SOURCE | Europe PMC |